OBJECTIVE： To investigate the effects of low-temperature preparation technology on the contents of total stilbenes and total anthraquinone in Polygonum cuspidatum ointment. METHODS： Using low-temperature preparation technology by adding P. cuspidatum powder into the sesame oil at lower oil temperature （80 ℃） to prepare Polygonum cuspidatum ointment. The content of total stilbene in P. cuspidatum ointment was determined by first-order derivative spectrophotometry at 343 nm and 345 nm using polydatin as control. The content of total anthraquinone in P. cuspidatum ointment was determined by spectrophotometry at 437 nm using emodin as control. The transfer rate of total stilbene and total anthraquinone in the preparation process of P. cuspidatum ointment were calculated. RESULTS： The linear ranges of polydatin and emodin were 4.24-14.84 μg/mL （r＝0.999 9） and 3.96-13.86 μg/mL （r＝0.999 5）， respectively. RSDs of precision， stability （6 h） and repeatability tests were all less than 3％ （n＝6 or n＝7）. The average recoveries were 99.43％ and 98.70％， and RSD were 0.94％ and 0.91％ （n＝6）， respectively. The average contents of total stilbene （by polydatin） in 3 batches of P. cuspidatum and P. cuspidatum ointment were （29.444±0.445）， （29.518±0.437）， （28.323±0.609） and （26.558±0.227）， （28.045±0.303）， （25.290±0.781） mg/g， respectively. The average contents of total anthraquinone （by emodin） were （20.557±0.257）， （19.520±0.292）， （18.795±0.444）， （18.438±0.240）， （18.621±0.017）， （16.808±0.076） mg/g， respectively. The transfer rates of total stilbene and total anthraquinone were （90.22±2.13）％， （95.01±0.38）％， （89.28±0.84）％ and （89.71±2.29）％， （95.41±1.52）％ and （89.46±2.52）％ after 3 batches of P. cuspidatum were added to 80 ℃ sesame oil to form ointment. CONCLUSIONS： The transfer rates of total stilbene and total anthraquinone are all over than 89％ in add P. cuspidatum powder into the sesame oil at lower oil temperature （80 ℃）， which indicates that it is rational to using low temperature preparation technology， and it can avoid the destruction of heat sensitive component.